Compact, packaged free-space optical interconnect

W. Lee Hendrick, Philippe J. Marchand, Fang Xu, Sadik C. Esener

Research output: Contribution to journalConference articlepeer-review


We present a packaged free-space optical interconnect, based on the Optical Transpose Interconnect System, which is designed to provide a bi-directional interconnection between two optoelectronic chips each of which contains thirty-two modulators and detectors. The optical system consists of two polarization-selective computer generated holograms, which combine a 4×8 lenslet array for illumination of the modulators and a 2×2 lenslet array for interconnection, allowing for a very simple and compact optical system. In addition to the holograms, the only other components necessary to complete the optical system are a polarizing beam splitter, two quarter-wave retardation plates, and a spacer. All of the optics are aligned and packaged into a single unit that is remarkably compact: 12.7×32.2 mm, weighing only 8.3 g.

Original languageEnglish (US)
Pages (from-to)520-529
Number of pages10
JournalProceedings of SPIE - The International Society for Optical Engineering
StatePublished - Jan 1 2000
Externally publishedYes
EventOptics in Computing 2000 - Quebec City, Can
Duration: Jun 18 2000Jun 23 2000

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


Dive into the research topics of 'Compact, packaged free-space optical interconnect'. Together they form a unique fingerprint.

Cite this