Abstract
The integration of optoelectronic and electronic components from different origins and substrates makes possible many advanced systems in diverse applications in photonics. To this end, various hybrid integration technologies including flip-chip bonding, epitaxial lift-off and direct bonding, substrate removal and "applique" bonding, microrobotic pick and place, and self-assembly methods have been explored. In this paper, we will briefly describe and evaluate these approaches for their applications in optoelectronics and focus on a new micro-assembly technology that can pick, place, and bond many devices of different origins and dimensions simultaneously in a parallel fashion on very large surfaces. We will present some of our preliminary results demonstrating the feasibility of this DNA-assisted micro-assembly technique.
| Original language | English (US) |
|---|---|
| Article number | 1029208 |
| Pages (from-to) | 113-140 |
| Number of pages | 28 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 10292 |
| DOIs | |
| State | Published - Jan 27 1998 |
| Externally published | Yes |
| Event | Heterogeneous Integration: Systems on a Chip: A Critical Review 1998 - San Jose, United States Duration: Jan 24 1998 → Jan 30 1998 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering