Free-space optical interconnection for three-dimensional stacked VLSI chips

Guoqiang Li, Dawei Huang, Emel Yuceturk, Mark M. Wang, Christoph Berger, Sadik C. Esener, Volkan H. Ozguz, Yue Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper presents a demonstration system under the three-dimensional optoelectronic stacked processor (3DOESP) project. A novel free-space hybrid optical system that permits large misalignment tolerance is designed for interconnections between 3D stacked VLSI chips.

Original languageEnglish (US)
Title of host publicationOptics in Computing, OC 2001
PublisherOptica Publishing Group (formerly OSA)
Number of pages3
ISBN (Electronic)9781557528209
StatePublished - 2001
Externally publishedYes
EventOptics in Computing, OC 2001 - Lake Tahoe, United States
Duration: Jan 9 2001 → …

Publication series

NameOptics InfoBase Conference Papers


ConferenceOptics in Computing, OC 2001
Country/TerritoryUnited States
CityLake Tahoe
Period1/9/01 → …

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials


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