@inproceedings{3455a6e968954c62a435ee6c37bcd436,
title = "Free-space optical interconnection for three-dimensional stacked VLSI chips",
abstract = "This paper presents a demonstration system under the three-dimensional optoelectronic stacked processor (3DOESP) project. A novel free-space hybrid optical system that permits large misalignment tolerance is designed for interconnections between 3D stacked VLSI chips.",
author = "Guoqiang Li and Dawei Huang and Emel Yuceturk and Wang, {Mark M.} and Christoph Berger and Esener, {Sadik C.} and Ozguz, {Volkan H.} and Yue Liu",
note = "Funding Information: The authors thank Xuezhe Zheng and Philippe J. Marchand for helpful discussions. This effort is sponsored by the Defense Advanced Research Projects Agency (DARPA) and Air Force Research Laboratory under agreement number F30602-97-2-0122. The US government is authorized to reproduce and distribute reprints for governmental purposes notwithstanding any copyright annotation thereon. Publisher Copyright: {\textcopyright} 2001 OSA/OC 2001.; Optics in Computing, OC 2001 ; Conference date: 09-01-2001",
year = "2001",
language = "English (US)",
series = "Optics InfoBase Conference Papers",
publisher = "Optica Publishing Group (formerly OSA)",
pages = "141--143",
booktitle = "Optics in Computing, OC 2001",
}