Directed assembly of optoelectronic components using electric fields

Donald E. Ackley, Carl F. Edman, Christian Gurtner, Rachel Formosa, Michael J. Heller, James J. Coleman

Research output: Contribution to journalConference articlepeer-review


The direct assembly of objects ranging in size from 100 nm to 10 μm onto electrode arrays fabricated on Si substrates is presented. By configuring electrodes on a host substrate and applying the appropriate potentials, it is possible to move and orient devices over a size ranging from 10-100 nm up to 10-20 μm. This ability to maneuver such a wide range of structures and sizes presents the opportunity to achieve new functionality in a format compatible with standard microelectronics technology.

Original languageEnglish (US)
Pages (from-to)167-168
Number of pages2
JournalConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
StatePublished - 1999
Externally publishedYes
EventProceedings of the 1999 12th Annual Meeting IEEE Lasers and Electro-Optics Society (LEOS'99) - San Francisco, CA, USA
Duration: Nov 8 1999Nov 11 1999

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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