TY - GEN
T1 - Fabrication, packaging, and catheter assembly of 2D CMUT arrays for endoscopic ultrasound and cardiac imaging
AU - Moini, Azadeh
AU - Nikoozadeh, Amin
AU - Choe, Jung Woo
AU - Khuri-Yakub, Butrus T.
AU - Chang, Chienliu
AU - Stephens, Doug
AU - Scott Smith, L.
AU - Sahn, David
N1 - Publisher Copyright:
Copyright © 2015 by ASME.
PY - 2015
Y1 - 2015
N2 - Ultrasound is increasingly in demand as a medical imaging tool and can be particularly beneficial in the field of intracardiac echocardiography (ICE). However, many challenges remain in the development of a 3D ultrasound imaging system. We have designed and fabricated a quad-ring capacitive micromachined ultrasound transducer (CMUT) for real-time, volumetric medical imaging. Each CMUT array is composed of four concentric, independent ring arrays, each operating at a different frequency, with 128 elements per ring. In this project, one ring will be used for imaging. A large (5mm diameter) lumen is available for delivering other devices, including high intensity focused ultrasound transducers for therapeutic applications or optical fibers for photoacoustic imaging. We address several challenges in developing a 3D imaging system. Through wafer vias are incorporated in the fabrication process for producing 2D CMUT arrays. Device integration with electronics is achieved through solder bumping the arrays, designing a flexible PCB, and flip chip bonding CMUT and ASICs to the flexible substrate. Finally, we describe a method for integrating the flex assembly into a catheter shaft. The package, once assembled, will be used for in-vivo open chest experiments.
AB - Ultrasound is increasingly in demand as a medical imaging tool and can be particularly beneficial in the field of intracardiac echocardiography (ICE). However, many challenges remain in the development of a 3D ultrasound imaging system. We have designed and fabricated a quad-ring capacitive micromachined ultrasound transducer (CMUT) for real-time, volumetric medical imaging. Each CMUT array is composed of four concentric, independent ring arrays, each operating at a different frequency, with 128 elements per ring. In this project, one ring will be used for imaging. A large (5mm diameter) lumen is available for delivering other devices, including high intensity focused ultrasound transducers for therapeutic applications or optical fibers for photoacoustic imaging. We address several challenges in developing a 3D imaging system. Through wafer vias are incorporated in the fabrication process for producing 2D CMUT arrays. Device integration with electronics is achieved through solder bumping the arrays, designing a flexible PCB, and flip chip bonding CMUT and ASICs to the flexible substrate. Finally, we describe a method for integrating the flex assembly into a catheter shaft. The package, once assembled, will be used for in-vivo open chest experiments.
UR - http://www.scopus.com/inward/record.url?scp=84953911452&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84953911452&partnerID=8YFLogxK
U2 - 10.1115/IPACK2015-48611
DO - 10.1115/IPACK2015-48611
M3 - Conference contribution
AN - SCOPUS:84953911452
T3 - ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
BT - Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays
PB - American Society of Mechanical Engineers
T2 - ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Y2 - 6 July 2015 through 9 July 2015
ER -