Light turning mirrors for hybrid integration of SiON-based optical waveguides and photodetectors

F. Civitci, G. Sengo, A. Driessen, M. Pollnau, A. J. Annema, H. J.W.M. Hoekstra

Research output: Contribution to journalArticlepeer-review

1 Scopus citations


For hybrid integration of an optical chip with an electronic chip containing photo-diodes and processing electronics, light must be coupled from the optical to the electronic chip. This paper presents a method to fabricate quasi-total-internal-reflecting mirrors on an optical chip, placed at an angle of 45° with the chip surface, that enable 90° out-of-plane light coupling between flip-chip bonded chips. The fabrication method utilizes a metal-free, parallel process and is fully compatible with conventional fabrication of optical chips. The mirrors are created using anisotropic etching of 45° facets in a Si substrate, followed by fabrication of the optical structures. After removal of the mirror-defining Si structures by isotropic etching, the obtained interfaces between optical structure and air direct the output from optical waveguides to out-of-plane photo-detectors on the electronic chip, which is aimed to be flip-chip mounted on the optical chip. For transverse-electric (transverse-magnetic) polarization simulations predict a functional loss of 7% (15%), while 7% (18%) is measured.

Original languageEnglish (US)
Pages (from-to)24375-24384
Number of pages10
JournalOptics express
Issue number20
StatePublished - Oct 7 2013
Externally publishedYes

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics


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