Exchanging data at high speed over sufficiently long distances becomes a bottleneck in high performance electronic processing systems. Opto-electronic devices have now been developed to a point that they can enable high speed and high-density free-space optical interconnections at the MCM level between multi-chip sets. In the following, we discuss packaging issues and some research directions for the insertion of free-space optical interconnects in electronic processors.
|Original language||English (US)|
|Number of pages||5|
|Journal||American Society of Mechanical Engineers, EEP|
|State||Published - 1999|
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering