Optical Interconnects for Silicon Chip Stacks

S. Esener, P. Marchand, F. Kiamilev, V. Ozguz, Y. Liu

Research output: Contribution to journalArticlepeer-review

1 Scopus citations


Exchanging data at high speed over sufficiently long distances becomes a bottleneck in high performance electronic processing systems. Opto-electronic devices have now been developed to a point that they can enable high speed and high-density free-space optical interconnections at the MCM level between multi-chip sets. In the following, we discuss packaging issues and some research directions for the insertion of free-space optical interconnects in electronic processors.

Original languageEnglish (US)
Pages (from-to)925-929
Number of pages5
JournalAmerican Society of Mechanical Engineers, EEP
Volume26 3
StatePublished - 1999
Externally publishedYes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering


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