Abstract
A significant progress in optoelectronic devices and their integration techniques have made free-space optical interconnects (FSOI) one of the few physical approaches that can potentially address the increasingly complex communication requirements at the board and chip levels. The advances made and the future research directions needed to bring FSOI to practice are discussed.
Original language | English (US) |
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Pages (from-to) | 433-435 |
Number of pages | 3 |
Journal | Materials Science in Semiconductor Processing |
Volume | 3 |
Issue number | 5-6 |
DOIs | |
State | Published - Oct 1 2000 |
Externally published | Yes |
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering